Problem encountered
Rapid wear and tear of the resistor caused by a too high concentration of a thermal agent inside the U's.
Objective
To increase resistor life without compromising thermal homogeneity.
Solutions
- Creation of a hole, with optimization of its shape, which will enable a better distribution of the thermal agent. Its size is restricted so as to avoid compromising temperature homogeneity of the load processed.
- The optimization is therefore obtained through a current distribution study (electrokinetics), in a single U simulated in 2D. This simplified approach has produced a fast and effective result.
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Example of an intermediary solution - Dissipated power |